A new generation of top-notch system-on-chip (SoC) from Qualcomm is starting to leak out. The successor to Snapdragon 855, which is likely to be called Snapdragon 865, was later said to be available in two variants. Gadget leaker Roland Quandt said that one of the Snapdragon 865 variants will have an integrated 5G Snapdragon X55 modem so that it can directly support 2G, 3G, 4G, up to 5G network connections. In the previous generation, in Snapdragon 855, Qualcomm did not unite the 5G modem with the SoC but provided it separately.
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The incorporation of the 5G modem on Snapdragon 865 is likely to anticipate the production of 5G phones that will be even more numerous next year. Furthermore, via the @rquandt Twitter account, Quandt called the next Snapdragon name code SM8250 with two variants named “Kona” and “Huracan”.
Kona is one of the cities in Hawaii, more precisely named Kailua-Kona. In this city, Qualcomm held an annual meeting several years ago. While Huracan is the god of wind, storm, and fire in Mayan mythology. It is not known which variant of the Snapdragon 865 will be integrated with the X55 modem later. Quandt said the two chips would support LPDDR5X type RAM, increasing from the existing standard LPDDR4X.
In addition, there will also be support for UFS 3.0 which is currently embedded in OnePlus 7 Pro. The technology allows faster data transfer processes. Snapdragon 865 will be built with 7nm technology. The possibility that the TSMC manufacturer based in Taiwan will produce this chip. But some rumours also say that Snapdragon 865 production will be handled by Samsung in Hwaseong, South Korea.
